English
Semiconductors are a high-tech industry that is often misunderstood as a “clean” industry, but in fact, semiconductor manufacturing plants use a large amount of acid, alkali, organic solvents and a variety of hazardous gases in processes such as cleaning, photolithography, stripping, and drying. Semiconductor manufacturing facilities face huge safety challenges due to the use of various toxic gases (such as hydrogen, hydrogen bromide, and hydrogen peroxide). As long as these gases are stored, distributed, or used in the manufacturing process, there is a possibility of dangerous situations, which will pose a serious threat to the health of workers and may disrupt the production process if not properly monitored, resulting in product losses.
Hydrogen (H2): Hydrogen is the lightest and most abundant element in the universe and is a colorless and odorless gas. It is an energy carrier in fuel cells and has great potential in the transition to clean energy. Industry also uses it to produce ammonia, refine metals, and as a reducing agent in various chemical processes. Although hydrogen is non-toxic, it is highly flammable and has
Hydrogen Bromide (HBr): Hydrogen bromide is a colorless or pale yellow gas with a pungent odor that is widely used in the synthesis of bromine compounds and as a catalyst in pharmaceutical and fine chemical production. It is also used in flame retardants and plasma etching in semiconductor manufacturing. Given the corrosive nature of HBr and the potential for the formation of hydrobromic acid, comprehensive safety measures are required to prevent inhalation and contact injuries.
Hydrogen peroxide is a pale blue liquid that becomes almost colorless when diluted and is widely used as a bleach and disinfectant. It is primarily used in the semiconductor industry for cleaning processes. Although it is less toxic than other industrial chemicals, its reactivity at certain concentrations requires careful handling and storage, as well as monitoring to prevent potential explosive reactions. Inhaling high concentrations of hydrogen peroxide can cause respiratory distress.
Nitric oxide is a colorless gas with a strong sweet odor that plays a vital role in various industries, including semiconductor manufacturing for chip production and as an intermediate in the synthesis of nitric acid. It is also used in medical applications for its vasodilation properties. However, NO quickly forms toxic nitrogen dioxide (NO2) in the air, requiring strict environmental monitoring and control in the workplace.
Ozone is a gas with a distinctive pungent odor that is highly regarded for its purifying properties and is widely used in water treatment and air purification. Excessive levels of ozone can cause breathing difficulties and other health problems, so it needs to be carefully monitored in occupational environments.
Chip manufacturing involves five major production stages: silicon wafer preparation, silicon wafer manufacturing, silicon wafer testing/picking, assembly and packaging, and final testing. These stages are independent of each other, and special gases are more or less involved in each stage. These gases must be continuously monitored to ensure the health and safety of employees, protect property, and maintain regulatory compliance.
